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Ver ICAPE rígido PCB técnicoEspecificação e capacidades

SELECT * FROM customer_pcb T, customer_pcb_panel P WHERE T.id=P.id_pcb and T.id=1053508 ORDER BY date DESC
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Unidade de entrega

Panel length

Comprimento do PCB

Panel width

Largura do PCB

Quant. de painéis

Quantidade de PCB

Unidade de comprimento

Tamanho da área do PCB:

44

PCB per panel

X out

Minimum batch size we may quote online is 0.0000001 square meter
Maximum batch size we may quote online is 50 square meter
Minimum PCB size is 10x10mm
Minimum Panel size is 10x10mm
Maximum PCB width is 480mm - Maximum PCB length is 580mm

Layer NC : Sem Cobre
SS : Single Sided
DS PTH : Double Sided - Plated Through Hole
ML 4: 4 Layers - Plated Through Hole
ML 6: 6 Layers - Plated Through Hole
ML 8: 8 Layers - Plated Through Hole
ML 10: 10 Layers - Plated Through Hole -

Stack-up

RaW Material / Tg Value i

PCB Thickness

Solder Mask

Solder Mask Color

Cor da Máscara de Solda

Inner CopperCompliant to IPC 6012 and IPC–A-600G
Thickness considered for based inner copper

Outer Copper Base

Outer Copper FinishedCompliant to IPC 6012 and IPC–A-600G
Thickness considered for finished outer copper

Plugging viaSeguindo regras IPC 4761-3A
O plug em vias deve ser identificado por em um layer especial no arquivo Gerber. Se não, nós não podemos produzir plug ing vias.
A plug in via será feita por tinta não condutiva antes ou após o processo da máscara de solda
A marca de tinta será diferente daquela da máscara de solda
As plugged vias serão realizadas antes de finalizar o processo
A via não será preenchida a 100% do comprimento

Material de preenchimento da via

FinishingElectroless Nickel Gold (0.025) => Ni:2 µm; Au: 0.025 µm
Electroless Nickel Gold (0.05) => Ni:4 µm; Au: 0.05 µm
HAL leadfree: 1 - 50 µm
OSP: Organic Surface Preparation

Extra prepregs

País ULUL certificates are in accordance with UL 94 V-0.

Ionic contamination1.56 µg/cm², seguindo as regras IPC, caso precise de um valor melhor, entre em contato conosco.

Impressão com carbonoIt is used for carbon contacts, if any.

Mask optionIt will protect a defined portion of the PCB during assembly. It can be removed easily.
Must be less than 20% of the PCB surface

Impedance control20% tolerance

V-scoring

Mini Via Diam.

Width & Space

IPC

CTI600Comparative tracking Index

Legend

Mask color


Press fit holesPress fit holes are plated through holes with tighter tolerances
than the standard +/-0.10mm.
Press fit holes fit the leads of connectors that will not be soldered
but pressed into the holes.

Production timeProduction time after solving (if necessary)
technical questions from our engineer on your technical document.
WD : Working Day(s)

Shipping method

Delivery country


Data de envioShipping from our factories

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Estimated Days to deliveryNúmero de dias úteis do envio

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Estimated Delivery DateLead time : production time + shipment time to your facility
Working days: from Monday to Friday (bank holiday will be extra)
A data de entrega de seus PCBs será confirmada após o término das Questões de Engenharia.

--/--/----
A data de entrega de seus PCBs será confirmada após o término das Questões de Engenharia.

EstêncilMaterial do estêncil : Aço 304-H-TA

Espessura do Estêncil

Borda do Estêncil

FrameThe key benefit of framed stencils is that they are pre-stretched

Solicite o seu estêncil hoje, ele será entregue com o sua PCI
Acesso aos preços ICAPE PCI e prazo de entrega

Criar conta / Entrar


NOVO para Lojas da ICAPE E CIPEM

A validação pode levar até um dia

Clientes de Lojas ICAPE OU CIPEM existentes

Esqueceu sua senha?

Taxa de câmbio : 1€ =1.090900$
Taxa de câmbio : 1€ = $

▼ PCB Rigid - Materials

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We have a large choice of PCB rigid materials. Please contact us for more information and a quote at marc.simonneau@icape.fr


Brand Name Type Series TG Value PDF
ITEQ FR-4 IT158 150 Download specs PDF
ITEQ FR-4 IT180A 170 Download specs PDF
KING BOARD FR-4 KB-6167 170 Download specs PDF
KING BOARD FR-4 KB-6160 130 Download specs PDF
KING BOARD FR-4 KB-6165 150 Download specs PDF
SHENG YI FR-4 S1000-2M 170 Download specs PDF
SHENG YI FR-4 S1000H 150 Download specs PDF
SHENG YI FR-4 S1141 130 Download specs PDF
SHENG YI FR-4 S1600 130 Download specs PDF
Brand Name Type Series TG Value PDF

▼ PCB Rigid - Technical specification and capabilities

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Download Capabilities


Specification Standard capabilities Advanced Capabilities
Layer count SS ~ 10 layers > 10 layers
PCB maximum size 500 x 560 mm 1040 x 560 mm
Raw materials FR4(Tg130,150,170), CEM1 CTI600, Rogers4350, 370HR
Board thickness 0,6mm to 3,2mm Other thickness on request
Thickness tolerance T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8%
Outer base Copper thickness 18µm ~ 105µm Other thickness on request
Inner base Copper thickness 18µm ~ 105µm Other thickness on request
Specification Standard capabilities Advanced Capabilities
Maxinum aspect ratio 10:1 15:1
Surface finish OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver Hard gold, Flash gold, Hybrid
Other surface finish Peelable mask, Carbon ink N/A
Gold finger Não Sim
Drill bit 0.25 ~ 6mm < 0.25mm, or > 6mm (Use routing to instead)
Minimum Width/Space on outer layer 4/4mil 3/3mil
Specification Standard capabilities Advanced Capabilities
Minimum Width/Space on inner layer 3/3mil 4/4mil
Minimum BGA pad size 12mils 10mils
Mininum solder mask bridge 5mils Base on copper thickness
Counter sink hole 60° Others on request
Half Holes (PTH) >= 0.8mm >= 0.6mm ~ < 0.8mm
Minimum hole to hole distance >= 12mils >= 10mils ~ < 12mils
Depth control routing +/- 0,25 mm N/A


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