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HDI PCB online order

Start quoting, view our price and place your order now to get express delivery of your HDI printed circuit board prototypes.
An HDI PCB, or High Density Interconnect PCB is a printed circuit board with a higher circuitry density.
An HDI PCB design usually includes finer lines and spaces, smaller vias and capture pads, and pads with high connection density.
A high density PCB incorporates blind, buried vias and microvias.
View ICAPE HDI PCB Technical Specification and Capabilities

Delivery unit

Panel Length

PCB Length

Panel Width

PCB Width

Panel Qty


Length unit

PCB per panel

Minimum batch size we may quote online is 0.0025 square meter
Maximum batch size we may quote online is 5 square meter
Minimum PCB size is 10x10mm
Maximum PCB width is 240mm - Maximum PCB length is 780mm


Number of step

Finished Cu Inner

Finished Cu Outer

Resin Filling

Copper Filling

Press Fit holes

Half holes

CounterSink holes

Board Thickness

Blind via

Buried via

Pealable soldermask

Laser drilling


Tg value i

Impedance control


Solder Mask

Solder Mask color

Shipping method

Delivery country

The delivery date of your PCBs will be confirmed after Engineering Questions are over.
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Currency rate : 1€ = 1.056300$
Currency rate : 1€ = $

▼ PCB HDI - Materials

We have a large choice of PCB HDI materials. Please contact us for more information and a quote at

Brand Name Type Series TG Value PDF
Brand Name Type Series TG Value PDF

▼ HDI PCB – High Density Interconnect PCB - Technical specification

Specification Standard capabilities Advanced Capabilities
Layer count 4 ~ 12 layers >=14 layers
HDI 1 step, 2 steps 3 steps or above
PCB maximum size 450 x 600 mm N/A
Raw materials FR4 TG170 CTI600, Rogers4350, 370HR
Board thickness 0,6mm to 3,2mm Other thickness on request
Thickness tolerance T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8%
Outer base Copper thickness 18um ~ 105um Other thickness on request
Inner base Copper thickness 18um ~ 105um Other thickness on request
Specification Standard capabilities Advanced Capabilities
Maxinum aspect ratio (PTH) 10:1 15:1
Maxinum aspect ratio (Laser) 0.8:1 1:1
Maxinum aspect ratio (Buried Via) 8:1 10:1
Surface finish OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver Hard gold, Flash gold, Hybrid
Other surface finish Peelable mask, Carbon ink N/A
Gold finger No Yes
Drill bit 0.25 ~ 6mm 6mm (Use routing to instead)
Laser hole size 4mils, 5mils, 6mils Other laser hole sizes on request
Specification Standard capabilities Advanced Capabilities
Buried hole size 8mils, 10mils, 12mils Other buried hole sizes on request
Minimum Width/Space on outer layer 4/4mil 3/3mil
Minimum Width/Space on inner layer 3/3mil 4/4mil
Minimum BGA pad size 12mils 10mils
Impedance < 50ohms:+/-5ohms, > 50ohms:+/-10% Other tolerance on request
Mininum solder mask bridge 5mils Base on copper thickness
Minimum hole to hole distance >= 12mils >= 10mils ~ < 12mils
Minimum buried via pitch 0.25 mm 0.2 mm