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View ICAPE Rigid PCB Technical Specification and Capabilities
Delivery unit
Panel length
PCB length
Panel width
PCB width
Panel qty
PCB quantity
Length unit
PCB area size :
PCB per panel
X out
Solder Mask
Solder Mask Color
Solder Mask Color type
Outer Copper Base
Via filling material
Extra prepregs
V Cut
Smallest Drilling Hole Size
Tracks Width / Space
IPC
Shipping method
Delivery country
We have a large choice of PCB rigid materials. Please contact us for more information and a quote at marc.simonneau@icape.fr
Brand Name | Type | Series | TG Value | |
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EMC | FR-4 | EM827 | 170 | Download specs PDF |
EMC | FR-4 | EM825 | 150 | Download specs PDF |
ITEQ | FR-4 | IT158 | 150 | Download specs PDF |
ITEQ | FR-4 | IT180A | 170 | Download specs PDF |
KING BOARD | FR-4 | KB-6167 | 170 | Download specs PDF |
KING BOARD | FR-4 | KB-6165 | 150 | Download specs PDF |
KING BOARD | FR-4 | KB-6160 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1141 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1600 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1000-2M | 170 | Download specs PDF |
SHENG YI | FR-4 | S1000H | 150 | Download specs PDF |
Brand Name | Type | Series | TG Value |
Specification | Standard capabilities | Advanced Capabilities |
---|---|---|
Layer count | SS ~ 10 layers | > 10 layers |
PCB maximum size | 500 x 560 mm | 1040 x 560 mm |
Raw materials | FR4(Tg130,150,170), CEM1 | CTI600, Rogers4350, 370HR |
Board thickness | 0,6mm to 3,2mm | Other thickness on request |
Thickness tolerance | T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% | T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8% |
Outer base Copper thickness | 18µm ~ 105µm | Other thickness on request |
Inner base Copper thickness | 18µm ~ 105µm | Other thickness on request |
Specification | Standard capabilities | Advanced Capabilities |
---|---|---|
Maxinum aspect ratio | 10:1 | 15:1 |
Surface finish | OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver | Hard gold, Flash gold, Hybrid |
Other surface finish | Peelable mask, Carbon ink | N/A |
Gold finger | No | Yes |
Drill bit | 0.25 ~ 6mm | < 0.25mm, or > 6mm (Use routing to instead) |
Minimum Width/Space on outer layer | 4/4mil | 3/3mil |
Specification | Standard capabilities | Advanced Capabilities |
---|---|---|
Minimum Width/Space on inner layer | 3/3mil | 4/4mil |
Minimum BGA pad size | 12mils | 10mils |
Mininum solder mask bridge | 5mils | Base on copper thickness |
Counter sink hole | 60° | Others on request |
Half Holes (PTH) | >= 0.8mm | >= 0.6mm ~ < 0.8mm |
Minimum hole to hole distance | >= 12mils | >= 10mils ~ < 12mils |
Depth control routing | +/- 0,25 mm | N/A |
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