Start quoting, view our price and place your order now to get express delivery of your HDI printed circuit board prototypes.
An HDI PCB, or High Density Interconnect PCB is a printed circuit board with a higher circuitry density.
An HDI PCB design usually includes finer lines and spaces, smaller vias and capture pads, and pads with high connection density.
A high density PCB incorporates blind, buried vias and microvias.
View ICAPE HDI PCB Technical Specification and Capabilities
Delivery unit
Panel Length
PCB Length
Panel Width
PCB Width
Panel Qty
PCB Qty
Length unit
PCB per panel
Layer
Number of step
Finished Cu Outer
Resin Filling
Copper Filling
Press Fit holes
Half holes
CounterSink holes
Board Thickness
Blind via
Buried via
Pealable soldermask
Laser drilling
Finishing
Solder Mask
Solder Mask color
Shipping method
Delivery country
We have a large choice of PCB HDI materials. Please contact us for more information and a quote at marc.simonneau@icape.fr
| Brand Name | Type | Series | TG Value | |
|---|---|---|---|---|
| Brand Name | Type | Series | TG Value |
| Specification | 成熟制程 | 先进制程 |
|---|---|---|
| 層数 | 4 ~ 12 层 | >=14 层 |
| 盲埋孔阶数 | 1 阶, 2 阶 | 3阶及以上 |
| 最大交付尺寸 | 450 x 600 mm | N/A |
| 基材 | FR4 TG170 | CTI600, Rogers4350, 370HR |
| 板厚 | 0,6mm to 3,2mm | 其它厚度要求 |
| 板厚公差 | T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% | T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8% |
| 外层基铜厚度 | 18um ~ 105um | 其它厚度要求 |
| 内层基铜厚度 | 18um ~ 105um | 其它厚度要求 |
| Specification | 成熟制程 | 先进制程 |
|---|---|---|
| 最大纵横比 (通孔) | 10:1 | 15:1 |
| 最大纵横比 (镭射孔) | 0.8:1 | 1:1 |
| 最大纵横比 (埋孔) | 8:1 | 10:1 |
| 表面处理 | OSP, 无铅喷锡, 有铅喷锡, 沉金, 沉锡, 沉银 | 电硬金, 电软金, 混合表面处理 |
| 其它表面处理 | 蓝胶, 碳油 | N/A |
| 金手指 | No | Yes |
| 钻咀尺寸 | 0.25 ~ 6mm | 6mm (大于6mm需要锣出) |
| 镭射孔尺寸 | 4mils, 5mils, 6mils | 其它尺寸 |
| Specification | 成熟制程 | 先进制程 |
|---|---|---|
| 埋孔尺寸 | 8mils, 10mils, 12mils | 其它尺寸 |
| 外层最小线宽线距 | 4/4mil | 3/3mil |
| 内层最小线宽线距 | 3/3mil | 4/4mil |
| 最小BGA pad尺寸 | 12mils | 10mils |
| 阻抗 | < 50ohms:+/-5ohms, > 50ohms:+/-10% | 其它公差要求 |
| 最小绿油桥 | 5mils | 最小绿油桥需要根据铜厚确定 |
| 最小孔距 | >= 12mils | >= 10mils ~ < 12mils |
| 埋孔孔中心到孔中心最小间距 | 0.25 mm | 0.2 mm |
