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HDI PCB online order

Start quoting, view our price and place your order now to get express delivery of your HDI printed circuit board prototypes.
An HDI PCB, or High Density Interconnect PCB is a printed circuit board with a higher circuitry density.
An HDI PCB design usually includes finer lines and spaces, smaller vias and capture pads, and pads with high connection density.
A high density PCB incorporates blind, buried vias and microvias.
View ICAPE HDI PCB Technical Specification and Capabilities

Delivery unit

Panel Length

PCB Length

Panel Width

PCB Width

Panel Qty


Length unit

PCB per panel

Minimum batch size we may quote online is 0.0025 square meter
Maximum batch size we may quote online is 5 square meter
Minimum PCB size is 10x10mm
Maximum PCB width is 780mm - Maximum PCB length is 240mm


Number of step

Finished Cu Inner

Finished Cu Outer

Resin Filling

Copper Filling

Press Fit holes

Half holes

CounterSink holes

Board Thickness

Blind via

Buried via

Pealable soldermask

Laser drilling


Tg value i

Impedance control


Solder Mask

Solder Mask color

Shipping method

Delivery country

The delivery date of your PCBs will be confirmed after Engineering Questions are over.
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Currency rate : 1€ = 1.090500$
Currency rate : 1€ = $

▼ PCB HDI - Materials

We have a large choice of PCB HDI materials. Please contact us for more information and a quote at

Brand Name Type Series TG Value PDF
Brand Name Type Series TG Value PDF

▼ HDI PCB – High Density Interconnect PCB - Technical specification

Specification 成熟制程 先进制程
層数 4 ~ 12 层 >=14 层
盲埋孔阶数 1 阶, 2 阶 3阶及以上
最大交付尺寸 450 x 600 mm N/A
基材 FR4 TG170 CTI600, Rogers4350, 370HR
板厚 0,6mm to 3,2mm 其它厚度要求
板厚公差 T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8%
外层基铜厚度 18um ~ 105um 其它厚度要求
内层基铜厚度 18um ~ 105um 其它厚度要求
Specification 成熟制程 先进制程
最大纵横比 (通孔) 10:1 15:1
最大纵横比 (镭射孔) 0.8:1 1:1
最大纵横比 (埋孔) 8:1 10:1
表面处理 OSP, 无铅喷锡, 有铅喷锡, 沉金, 沉锡, 沉银 电硬金, 电软金, 混合表面处理
其它表面处理 蓝胶, 碳油 N/A
金手指 No Yes
钻咀尺寸 0.25 ~ 6mm 6mm (大于6mm需要锣出)
镭射孔尺寸 4mils, 5mils, 6mils 其它尺寸
Specification 成熟制程 先进制程
埋孔尺寸 8mils, 10mils, 12mils 其它尺寸
外层最小线宽线距 4/4mil 3/3mil
内层最小线宽线距 3/3mil 4/4mil
最小BGA pad尺寸 12mils 10mils
阻抗 < 50ohms:+/-5ohms, > 50ohms:+/-10% 其它公差要求
最小绿油桥 5mils 最小绿油桥需要根据铜厚确定
最小孔距 >= 12mils >= 10mils ~ < 12mils
埋孔孔中心到孔中心最小间距 0.25 mm 0.2 mm