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Rigid-flex PCB online quote

Request a quote online today, and get an offer in two to three working days for Rigid-flex printed circuit board prototypes.
Rigid-flex printed circuit boards are PCB combining rigid and flexible board technologies.
A Rigid-flex PCB design improves the reliability of applications by reducing the amount of interconnect points.
The less interconnection you have on a design, the stronger your circuit board is, ultimately lowering the final costs of your device or application.
View ICAPE Rigid-flex PCB Technical Specification and Capabilities


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▼ Rigid-Flex PCB - Technical specification and capabilities




Specification 成熟制程 先进制程
层数 双面 ~ 8层 10层 ~ 12层
最大交付尺寸 380 x 560mm 380 x 736mm
硬板部分基材 FR4(Tg130,150,170) Rogers4350, 370HR
软板部分基材 无胶基材 (Polyimide), 有胶基材 (Polyimide, PET) 其它物料要求
Polyimide 基材厚度 (PI 厚度) 12.5µm, 20µm, 25µm, 50µm 其它厚度要求
粘合剂厚度 12.5µm, 20µm 其它厚度要求
硬板部分板厚 0.4mm ~ 2.5mm 其它厚度要求
Specification 成熟制程 先进制程
板厚公差 板厚1.0mm:+/-10% N/A
软板部分板厚 0.07mm to 0.2mm 其它厚度要求
板厚公差 +/-0.05mm N/A
板厚公差 18um ~ 105mm 其它厚度要求
软板部分铜厚 12um ~ 70µm 其它厚度要求
最大纵横比 (通孔) 8:1 12:1
最大纵横比 (镭射孔) 0.8:1 1:1
表面处理 OSP,沉金 电软金, 沉锡, 沉银, 无铅喷锡
金手指 No Yes
Specification 成熟制程 先进制程
覆盖膜颜色 黄色,黑色,白色 其它颜色要求
最小覆盖膜开窗 Φ0.6mm,或者 0.6*0.4mm N/A
最小覆盖膜桥 0.3mm 0.25mm
软硬结合板软硬合处的溢胶量 1.5mm 0.5mm
最小软板宽度(仅限于软硬结合板) 1.5mm 1.2mm
钻咀尺寸(机械钻) 0.15-6.0mm 其它颜色要求
最小镭射孔径 0.075mm 其它颜色要求
镭射切割 +/-0.1mm 其它颜色要求
冲压公差 +/-0.13mm 其它颜色要求

Rigid Flex PCB Stack-up