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Rigid PCB online order

Start quoting, view our price and place your order now to get express delivery of your rigid printed circuit board prototypes.

View ICAPE Rigid PCB Technical Specification and Capabilities


SELECT * FROM customer_pcb T, customer_pcb_panel P WHERE T.id=P.id_pcb and T.id=1053387 ORDER BY date DESC

交货单元

交货拼板长度

单元长度

交货拼板宽度

单元宽度

拼板数量

单元数量

单元长度

PCB area size :

44

PCB per panel

X out

Minimum batch size we may quote online is 0.0000001 square meter
Maximum batch size we may quote online is 50 square meter
Minimum PCB size is 10x10mm
Minimum Panel size is 10x10mm
Maximum PCB width is 480mm - Maximum PCB length is 580mm

板料 / Tg Value i

成品板厚

阻焊油墨

Solder Mask Color

Solder Mask Color type

Outer Copper Base

Extra prepregs



运输方式

到达的国家


The delivery date of your PCBs will be confirmed after Engineering Questions are over.

Stencil thickness

Stencil Edge

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Validation can take up to one day

EXISTING ICAPE OR CIPEM Shops clients


匯率:1歐元 =1.090900$
匯率:1歐元 = $

▼ PCB Rigid - Materials



We have a large choice of PCB rigid materials. Please contact us for more information and a quote at marc.simonneau@icape.fr


Brand Name Type Series TG Value PDF
ITEQ FR-4 IT158 150 Download specs PDF
ITEQ FR-4 IT180A 170 Download specs PDF
KING BOARD FR-4 KB-6167 170 Download specs PDF
KING BOARD FR-4 KB-6160 130 Download specs PDF
KING BOARD FR-4 KB-6165 150 Download specs PDF
SHENG YI FR-4 S1000-2M 170 Download specs PDF
SHENG YI FR-4 S1000H 150 Download specs PDF
SHENG YI FR-4 S1141 130 Download specs PDF
SHENG YI FR-4 S1600 130 Download specs PDF
Brand Name Type Series TG Value PDF

▼ PCB Rigid - Technical specification and capabilities




Specification 成熟制程 先进制程
層数 单面 ~ 10 层 >10 层
最大交付尺寸 500 x 560 mm 1040 x 560 mm
基材 FR4(Tg130,150,170), CEM1 CTI600, Rogers4350, 370HR
板厚 0,6mm to 3,2mm 其它厚度要求
板厚公差 板厚1.0mm:+/-10% 板厚1.0mm:+/- 8%
外层基铜厚度 18µm ~ 105µm 其它厚度要求
内层基铜厚度 18µm ~ 105µm 其它厚度要求
Specification 成熟制程 先进制程
最大纵横比 10:1 15:1
表面处理 OSP, 无铅喷锡, 有铅喷锡, 沉金, 沉锡, 沉银 电硬金, 电软金, 混合表面处理
其它表面处理 蓝胶, 碳油 N/A
金手指 No Yes
钻咀尺寸 0.25 ~ 6mm 6mm (大于6mm需要锣出)
外层最小线宽线距 4/4mil 3/3mil
Specification 成熟制程 先进制程
内层最小线宽线距 3/3mil 4/4mil
最小BGA pad尺寸 12mils 10mils
最小绿油桥 5mils 最小绿油桥需要根据铜厚确定
沉头孔 60° 其它尺寸和角度要求
通孔半孔 >= 0.8mm >= 0.6mm ~ < 0.8mm
最小孔距 >= 12mils >= 10mils ~ < 12mils
深度控制锣公差 +/- 0,25 mm N/A


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Parameters

X
Y
顶层
底层
Left
Right
Circuit separation X
Circuit separation Y