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View ICAPE Rigid PCB Technical Specification and Capabilities
交货单元
交货拼板长度
单元长度
交货拼板宽度
单元宽度
拼板数量
单元数量
单元长度
PCB area size :
PCB per panel
X out
阻焊油墨
Solder Mask Color
Solder Mask Color type
Outer Copper Base
Via filling material
Extra prepregs
最小过孔孔径
线宽线距
IPC
We have a large choice of PCB rigid materials. Please contact us for more information and a quote at marc.simonneau@icape.fr
Brand Name | Type | Series | TG Value | |
---|---|---|---|---|
ITEQ | FR-4 | IT158 | 150 | Download specs PDF |
ITEQ | FR-4 | IT180A | 170 | Download specs PDF |
KING BOARD | FR-4 | KB-6167 | 170 | Download specs PDF |
KING BOARD | FR-4 | KB-6160 | 130 | Download specs PDF |
KING BOARD | FR-4 | KB-6165 | 150 | Download specs PDF |
SHENG YI | FR-4 | S1000-2M | 170 | Download specs PDF |
SHENG YI | FR-4 | S1000H | 150 | Download specs PDF |
SHENG YI | FR-4 | S1141 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1600 | 130 | Download specs PDF |
Brand Name | Type | Series | TG Value |
Specification | 成熟制程 | 先进制程 |
---|---|---|
層数 | 单面 ~ 10 层 | >10 层 |
最大交付尺寸 | 500 x 560 mm | 1040 x 560 mm |
基材 | FR4(Tg130,150,170), CEM1 | CTI600, Rogers4350, 370HR |
板厚 | 0,6mm to 3,2mm | 其它厚度要求 |
板厚公差 | 板厚1.0mm:+/-10% | 板厚1.0mm:+/- 8% |
外层基铜厚度 | 18µm ~ 105µm | 其它厚度要求 |
内层基铜厚度 | 18µm ~ 105µm | 其它厚度要求 |
Specification | 成熟制程 | 先进制程 |
---|---|---|
最大纵横比 | 10:1 | 15:1 |
表面处理 | OSP, 无铅喷锡, 有铅喷锡, 沉金, 沉锡, 沉银 | 电硬金, 电软金, 混合表面处理 |
其它表面处理 | 蓝胶, 碳油 | N/A |
金手指 | No | Yes |
钻咀尺寸 | 0.25 ~ 6mm | 6mm (大于6mm需要锣出) |
外层最小线宽线距 | 4/4mil | 3/3mil |
Specification | 成熟制程 | 先进制程 |
---|---|---|
内层最小线宽线距 | 3/3mil | 4/4mil |
最小BGA pad尺寸 | 12mils | 10mils |
最小绿油桥 | 5mils | 最小绿油桥需要根据铜厚确定 |
沉头孔 | 60° | 其它尺寸和角度要求 |
通孔半孔 | >= 0.8mm | >= 0.6mm ~ < 0.8mm |
最小孔距 | >= 12mils | >= 10mils ~ < 12mils |
深度控制锣公差 | +/- 0,25 mm | N/A |
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Y
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顶层 |
底层 |
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Right |
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Circuit separation X
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Circuit separation Y
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